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Precision Polishing Machine×ムサシノ電子 - List of Manufacturers, Suppliers, Companies and Products

Precision Polishing Machine Product List

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Precision Grinding Device "MA-400e"

Precision Grinding Device "MA-400e"

High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.

The "MA-400e" is a precision grinding device with a spindle directly mounted on a surface plate that has been ground and finished with high precision. The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. By combining the automatic grinding mechanism's roller holding unit, roller-type swinging holding unit, and various sample holders, we have achieved high-precision automatic grinding for electronic materials, electronic components, ceramics, metal materials, as well as for the pretreatment of TEM, SEM, SIMS samples, and orientation using X-rays. 【Features】 - The spindle is directly mounted on a surface plate that has been ground and finished with high precision. - High-precision angular bearings are used in the spindle. - Achieves flatness accuracy within ±10μm on the reference table. - The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-300e"

Precision Grinding Device "MA-300e"

Interlock covers are also available! We have achieved further efficiency in polishing operations.

The "MA-300e" is a precision polishing device suitable for polishing large samples such as 3-inch and 4-inch specimens. By installing automatic sample holding units in three locations, it achieves further efficiency in polishing operations. Additionally, by equipping a shaking device, it is expected to improve polishing accuracy and maintain the flatness of the polishing disc. It adopts a sequence control program, allowing for centralized management of the polishing process recipes. 【Features】 - Suitable for polishing large samples such as 3-inch and 4-inch specimens - Three automatic sample holding units installed for further efficiency in polishing operations - Adopts a sequence control program for centralized management of polishing process recipes - Equipped with a leakage breaker and emergency stop button for safe and secure polishing operations - Interlock cover also available *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-200e"

Precision Grinding Device "MA-200e"

Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.

The "MA-200e" is a precision grinding device that is highly accurate and suitable for sample preparation in research and development. With the emergency stop button, leakage breaker, and interlock cover (optional), it enables grinding operations with a focus on safety and security. Additionally, it is now possible to manage a wide variety of grinding processes and recipes collectively via a touch panel. 【Features】 ■ Highly accurate and suitable for sample preparation in research and development ■ Improved drive system and rigidity successfully reduce vibration and noise significantly ■ Comfortable operation with digital control using an LCD touch panel ■ Ability to collectively manage a wide variety of grinding processes and recipes via the touch panel ■ Enables grinding operations with a focus on safety and security *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-200"

Precision Grinding Device "MA-200"

There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!

The "MA-200" is a precision polishing device that offers high accuracy and is suitable for sample preparation in research and development. By using polishing discs and abrasives tailored to the samples, better polished surfaces can be achieved, with polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less. It is also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN. 【Features】 ■ High accuracy, suitable for sample preparation in research and development ■ Better polished surfaces can be achieved by using polishing discs and abrasives tailored to the samples ■ Polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less ■ No edge rounding and no detachment of inclusions, making it suitable for evaluation with EPMA and similar techniques ■ Also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-150"

Precision Grinding Device "MA-150"

Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.

The "MA-150" is a personal-type polishing machine designed to be installed next to SEM, EPMA, TEM, etc., allowing one machine to be used for one specific purpose. Its compact size does not take up much space, making it suitable for polishing small samples, and it can polish materials such as semiconductor wafers, sapphire, SiC, glass, and ceramics. By using polishing discs and abrasives tailored to the sample, better polished surfaces can be achieved. 【Features】 ■ Personal-type polishing machine ■ Designed and developed to allow one machine to be used for one specific purpose ■ Better polished surfaces can be obtained by using polishing discs and abrasives suited to the sample ■ Compact size does not occupy much space, making it ideal for polishing small samples ■ Capable of polishing semiconductor wafers, sapphire, SiC, glass, ceramics, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • CMP Equipment
  • Other processing machines

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Precision Grinding Device MA Series

Precision Grinding Device MA Series

Reproducibility in sample grinding

By selecting a suitable sample holder for the sample, various shapes and processing purposes for polishing can be achieved. This is a tabletop precision polishing device that is optimal for sample preparation for TEM and SEM observation. Additionally, by replacing the polishing disc and polishing agents, it can handle everything from rough polishing to mirror finishing and CMP (Chemical Mechanical Polishing) with just one unit. 【Examples of materials with processing achievements】 - Semiconductor materials: Si / SiC / GaN / GaAs / InP / Ga2O3 … - Optical materials: Glass / Sapphire / CLBO / YiG / GGG … - Ceramic materials: Alumina / Silicon Nitride … Furthermore, we have numerous achievements with other materials such as metals, minerals, and biological samples.

  • Wafer processing/polishing equipment

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